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Micron breaks ground on new flash memory fabrication plant in Singapore.
Published by The Business Times on April 5 2019
“On 4 April 2018, SEMICONDUCTOR giant Micron Technology broke ground in the north of Singapore to add new cleanroom space to meet future manufacturing requirements for its 3D NAND flash memory products. … Construction of the new facility is expected to be completed in mid-2019, with initial wafer output expected in the fourth quarter of 2019.”
Micron breaks ground on new flash memory fabrication plant in Singapore.
Published by The Business Times on April 5 2019
“On 4 April 2018, SEMICONDUCTOR giant Micron Technology broke ground in the north of Singapore to add new cleanroom space to meet future manufacturing requirements for its 3D NAND flash memory products. … Construction of the new facility is expected to be completed in mid-2019, with initial wafer output expected in the fourth quarter of 2019.”
Micron breaks ground on new flash memory fabrication plant in Singapore.
Published by The Business Times on April 5 2019
“On 4 April 2018, SEMICONDUCTOR giant Micron Technology broke ground in the north of Singapore to add new cleanroom space to meet future manufacturing requirements for its 3D NAND flash memory products. … Construction of the new facility is expected to be completed in mid-2019, with initial wafer output expected in the fourth quarter of 2019.”
Micron breaks ground on new flash memory fabrication plant in Singapore.
Published by The Business Times on April 5 2019
“On 4 April 2018, SEMICONDUCTOR giant Micron Technology broke ground in the north of Singapore to add new cleanroom space to meet future manufacturing requirements for its 3D NAND flash memory products. … Construction of the new facility is expected to be completed in mid-2019, with initial wafer output expected in the fourth quarter of 2019.”